MUMBAI, India, Oct. 12 -- Intellectual Property India has published a patent application (202641119808 A) filed by Chennai Institute Of Technology on October 07, 2026, for Modular Retrofit System For Cementitious Material Extrusion Using A Three-Dimensional Printer.
Inventors include Mr. S. Karthikeyan; Mrs. Swathi Rekha; Dr. P. Vasanthi; Mr. Pradeep Castro. P; Dr. Dhinakaran; and Mr. Murugan. V.
The application for the patent was published on October 09, 2026, under issue no. 41/2026.
Abstract: The present disclosure relates to a modular retrofit system (100) for converting a three-dimensional printer configured for thermoplastic material deposition into a cementitious-material extrusion printer. The system comprises a base three-dimensional printer assembly (100B) having a multi-axis motion system, a detachable material storage unit (124), a material feeding unit (100C) having a driven conveying member, and a concrete extrusion assembly (100D) having an extrusion chamber and a replaceable nozzle (132). A retrofit support structure detachably mounts the material storage unit, material feeding unit and concrete extrusion assembly to the base printer. A control and synchronization unit (100E) coordinates material feed rate with printer movement and extrusion parameters to provide controlled layer-by- layer deposition along a programmed path. The detachable modular arrangement permits conversion between thermoplastic and cementitious-material printing configurations without replacing the base printer, thereby enabling adaptable additive manufacturing of cementitious structures.
Disclaimer: Curated by HT Syndication.
