MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617083928 A) filed by Global Polymer Industries, Inc. on July 08, 2026, for Molding Apparatus And Method.
Inventor includes Huntimer, Todd, M..
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Embodiments are directed to a compression molding apparatus. The compression molding apparatus may include a female mold, a heated male mold, and a cooled male mold. The female mold may carry ultra-high-molecular-weight polyethylene ("UHMW") material. The heated male mold may compress the UHMW material in the female mold during a first time period. The cooled male mold may compress the UHMW material in the female mold during a second time period.
Disclaimer: Curated by HT Syndication.
