MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202648114274 A) filed by Xilinx, Inc. on September 24, 2026, for Multi-Die Integrated Circuit With Data Processing Engine Array.
Inventors include Noguera Serra, Juan J.; Tuan, Tim; and Subramanian, Sridhar.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: MULTI-DIE INTEGRATED CIRCUIT WITH DATA PROCESSING ENGINE ARRAY A multi-die integrated circuit (IC) can include an interposer and a first die coupled to the interposer. The first die can include a data processing engine (DPE) array, wherein the DPE array includes a plurality of DPEs and a DPE interface coupled to the plurality of DPEs. The DPE interface has a logical interface and a physical interface. The multi-die IC also can include a second die coupled to the interposer. The second die can include a die interface. The DPE interface and the die interface are configured to communicate through the interposer. Fig. 3
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