MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202615071205 A) filed by Apple Inc. on June 08, 2026, for Multiple Independent On-Chip Interconnect.
Inventors include Kolor, Sergio; Tota, Sergio V.; Zemer, Tzach; Lahav, Sagi; Redshaw, Jonathan M.; Hammarlund, Per H.; Tamari, Eran; Vash, James; Garg, Gaurav; Zimet, Lior; Kaushikkar, Harshavardhan Filed On; Fishwick, Steven; Hutsell, Steven R.; and Fukami, Shawn M..
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: In an embodiment, a system on a chip (SOC) comprises a semiconductor die on which circuitry is formed, wherein the circuitry comprises a plurality of agents and a plurality of network switches coupled to the plurality of agents. The 5 plurality of network switches are interconnected to form a plurality of physical and logically independent networks. A first network of the plurality of physically and logically independent networks is constructed according to a first topology and a second network of the plurality of physically and logically independent networks is constructed according to a second topology that is different from the 10 first topology. For example, the first topology may a ring topology and the second topology may be a mesh topology. In an embodiment, coherency may be enforced on the first network and the second network may be a relaxed order network. 15
Disclaimer: Curated by HT Syndication.
