MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202647095369 A) filed by Qualcomm Incorporated on August 06, 2026, for Overlapping Physical Layer Protocol Data Unit End Point Offset.
Inventors include Helwa, Sherief; Cherian, George; Patil, Abhishek Pramod; Naik, Gaurang; Asterjadhi, Alfred; Kalamkar, Sanket Sanjay; Ho, Sai Yiu Duncan; Chisci, Giovanni; Shivamurthy, Abhi; and Gupta, Sanket.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: This disclosure provides methods, components, devices and systems for overlapping physical layer protocol data unit (PPDU) end point offset. Some aspects more specifically relate to staggering the end times of overlapping PPDUs transmitted by multiple access points (APs) such that the corresponding block acknowledgments (BAs) are staggered by durations exceeding BA locking periods for the APs. In some examples, a BA may be transmitted by a wireless station (STA) to an AP a short interframe space (SIFS) after the end time of a PPDU transmitted by the AP. When multiple APs transmit concurrent PPDUs, multiple STAs may accordingly transmit corresponding BAs. By implementing techniques to stagger the BAs, an AP that locks onto a BA and determines that the BA is intended for another AP can receive a next staggered BA intended for the AP.
Disclaimer: Curated by HT Syndication.
