Intellectual Property India Publishes Patent Application for Polymer Composition, Film And Package Having Improved Hermiticity

MUMBAI, India, June 26 -- Intellectual Property India has published a patent application (202647071161 A) filed by Sabic Global Technologies B. V. on June 08, 2026, for Polymer Composition, Film And Package Having Improved Hermiticity.

Inventors include Cheng, Lanya; Li, Changda; Al-Hussain, Saad Nasser Number; Patham, Bhaskar; Soliman, Maria; and Li, Yuan.

The application for the patent was published on June 19, 2026, under issue no. 25/2026.

Abstract: The invention relates to a polymer composition comprising: (a) = 50.0 wt%, preferably = 60.0 wt% and = 90.0 wt%, with regard to the total weight of the polymer composition, of a first ethylene-based copolymer having a density of = 850 and = 910 kg/m3, preferably = 870 and = 910 kg/m3, more preferably = 890 and = 910 kg/m3, as determined in accordance with ASTM D792 (2013), and a melt mass-flow rate determined at 190°C under a load of 2.16 kg (MFR2) in accordance with ASTM D1238-13 of = 0.2 and = 10.0 g/10 min; (b) optionally, a second ethylene-based copolymer having a density of = 912 and = 940 kg/m3, preferably = 5.0 and = 20.0 wt% of the second ethylene-based copolymer, with regard to the total weight of the polymer composition; and (c) optionally, a low-density polyethylene having a density of 900 and 930 kg/m3, preferably = 5.0 and = 20.0 wt% of the low-density polyethylene, with regard to the total weight of the polymer composition; wherein the first ethylene-based copolymer is an ethylene/1-octene copolymer comprising = 18.0 wt% of polymeric units derived from 1-octene, with regard to the total weight of the first ethylene-based copolymer, and wherein the first ethylene-based copolymer has a molecular weight distribution Mw/Mn of = 3.0, wherein Mw is the weight average molecular weight and Mn is the number average molecular weight, as determined in accordance with ASTM D6474 (2012). Such polymer composition allows for production of packages comprising thermal seals at low temperatures, whilst producing seals of high hermiticity.

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