MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202411095429 A) filed by Lovely Professional University on December 04, 2024, for Polypyrrole-Tungsten Disulfide Nanocomposite For Electromagnetic Interference Shielding.
Inventors include Anil Kumar; Raeesah Islam; and Harish Mudila.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: The present invention relates to a polypyrrole-tungsten disulfide nanocomposite designed for electromagnetic interference (EMI) shielding applications. The nanocomposite comprises a polypyrrole (PPy) matrix synthesized through an in-situ oxidative polymerization process using pyrrole monomers and an oxidizing agent, FeCl3, which forms a conductive matrix around uniformly dispersed tungsten disulfide (WS2) particles. The WS2 particles are evenly distributed within the pyrrole solution via ultrasonication and magnetic stirring prior to polymerization, preventing agglomeration and ensuring a homogeneous mixture. This nanocomposite exhibits enhanced electrical conductivity and mechanical stability, providing effective EMI shielding. The PPy matrix contributes to high electrical conductivity, while the WS2 particles enhance dielectric loss, collectively improving shielding effectiveness. The composite is lightweight, flexible, and maintains its shielding properties and mechanical stability over an extended period, making it suitable for various structural applications.
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