MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202411095420 A) filed by Lovely Professional University on December 04, 2024, for Porous Cylindrical Heat Exchanger For Industrial And Electronic Thermal Management.
Inventor includes Sourav Mukherjee.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: The invention pertains to the field of thermal management systems, specifically a porous cylindrical heat exchanger designed for industrial and electronic applications. The heat exchanger comprises a plurality of porous cylindrical structures with a porous geometry, integrated with fluid channels to optimize fluid flow paths. These structures and channels are constructed using high- conductivity alloys, such as copper and aluminum, to facilitate rapid heat transfer. Specialized thermal coatings are applied to enhance the emissivity and absorptivity of the surfaces, and are engineered to withstand high temperatures and pressures. The porous structures are strategically placed to increase turbulence and improve heat exchange efficiency. The invention also includes a prototype testing setup to validate performance under various operational parameters, and employs advanced manufacturing techniques like 3D printing for fabrication. The design is compact and cost-effective, with innovative fluid channel geometries tailored to boost turbulence, thereby enhancing the overall thermal management capability.
Disclaimer: Curated by HT Syndication.
