MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202641097028 A) filed by Sri Venkateswara College Of Engineering; Dr M Chandra Sekhara Reddy; Mr Ravi Roopkumar; Dr N Balaji Ganesh; Dr S Jaya Kishore; Mr M Peeraiah; Dr E Venkata Kondaiah; Mr K Harshavardhan Reddy; Mr D Anjan Kumar Reddy; Mr Gopala Krishna M; and Mr P Charan Theja on August 11, 2026, for Predictive Thermal Performance Assessment System For Mechanical Systems.
Inventors include Dr M Chandra Sekhara Reddy; Mr Ravi Roopkumar; Dr N Balaji Ganesh; Dr S Jaya Kishore; Mr M Peeraiah; Dr E Venkata Kondaiah; Mr K Harshavardhan Reddy; Mr D Anjan Kumar Reddy; Mr Gopala Krishna M; and Mr P Charan Theja.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: The present invention relates to the development of a predictive thermal performance evaluation system that assesses, monitors, and predicts thermal performance and thermal stress in real time. Using the physics-informed machine learning approach that combines physics-based numerical simulation and machine learning, the system is able to process operational parameters like load variation, coolant flow rate, and environmental temperature in order to predict thermal degradation in real time before failure occurs. The effectiveness of the proposed system has been experimentally validated using rotating machines and heat exchangers, proving to be highly accurate with reduced downtime and maintenance cost. FIG.1
Disclaimer: Curated by HT Syndication.
