MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202627061996 A) filed by Xiamen Hongfa Electric Power Controls Co. , Ltd. on May 15, 2026, for Relay.
Inventors include Dai, Wenguang; Wu, Zhuxiong; Zhong, Shuming; Chen, Songsheng; and Chen, Weipeng.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: A high-voltage direct-current relay, comprising an auxiliary static assembly and an auxiliary moving spring, wherein the auxiliary moving spring comprises a leaf spring and auxiliary moving contact points, a plurality of auxiliary moving contact points are provided at one end of the leaf spring, and each auxiliary moving contact point is used for being in contact with or separated from the auxiliary static assembly. According to the high-voltage direct-current relay in the embodiments of the present application, there are a plurality of auxiliary moving contact points at one end of the auxiliary moving spring, and each auxiliary moving contact point is used for being in contact with or separated from the auxiliary static assembly, so that at least two contact points are formed between the auxiliary moving spring and the auxiliary static assembly.
Disclaimer: Curated by HT Syndication.
