MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202627061998 A) filed by Xiamen Hongfa Electric Power Controls Co. , Ltd. on May 15, 2026, for Relay.
Inventors include Dai, Wenguang; Wu, Zhuxiong; Zhong, Shuming; Chen, Songsheng; and Chen, Weipeng.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: A relay, comprising a yoke plate, auxiliary static assemblies, and an auxiliary moving reed. The yoke plate is provided with first mounting holes. Each auxiliary static assembly comprises an insulating member, a lead-out pin and an auxiliary static contact. The insulating member surrounds the outer circumferential surface of the lead- out pin, and is connected to the yoke plate in an insulated manner by means of the insulating member. The auxiliary static contact is connected to the end of the lead-out pin extending out of the surface on one side in the thickness direction of the yoke plate. The auxiliary moving reed is configured to make contact with or be separated from the auxiliary static contact. The lead-out pin is made of a first material, the auxiliary static contact is made of a second material, and conductivity of the second material is superior to that of the first material.
Disclaimer: Curated by HT Syndication.
