MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202641082174 A) filed by Manipal Academy Of Higher Education on July 03, 2026, for Rolling Pin Device And Method For Flattening, Compressing, Shaping, Or Processing A Deformable Material.
Inventor includes Krishnananda Prabhu Rv.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Embodiments of the present disclosure relate to a rolling pin device (100) and method (200) for flattening, compressing, shaping, or processing a deformable material. The system (100) includes elongated rollers (102), connecting members (104), a support structure (106) and a towing member (110). The elongated rollers (102) are arranged in a serial configuration along a direction of movement. The connecting members (104) and support structure (106) are configured to mechanically couple adjacent rollers (102) to form an articulated rolling assembly configured to move as a unit. The support structure (106) is positioned above rollers (102). The load receiving portion is disposed on the support structure (106) and configured to receive one or more removable or adjustable weights (108) for generating a downward force on the plurality of rollers (102). The towing member (110) is operatively coupled to the articulated rolling assembly for manually advancing the rolling pin device (100) over the deformable material.
Disclaimer: Curated by HT Syndication.
