MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202441101433 A) filed by Valeo Eautomotive Germany Gmbh on December 20, 2024, for Rotor Core With Improved Heat Conduction.
Inventors include Mathiyalagan, Anand; Sridhar, Karthikeyan; Sundararajan, Panneerselvam; Rajkamarajar, Subasree; and Ravichandran, Balaji.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: ROTOR CORE WITH IMPROVED HEAT CONDUCTION The present subject matter relates to a rotor assembly (100) that includes a rotor core (102) having a central axis (108), coaxially coupled to a rotor shaft (106). The rotor core (102) includes a stack of laminations (104) mounted on the rotor shaft (106). Each lamination from the stack of laminations (104) is provided with a central hole through which the rotor shaft (106) is passed. Further, one or more oblong holes (110) is arranged around the central hole. In addition, a filler material (112) is filled in the one or more oblong holes (110). The filler material (112) is composed of thermally conductive material. FIG. 1A
Disclaimer: Curated by HT Syndication.
