MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202617070177 A) filed by Arcelormittal on June 04, 2026, for Sandwich Panel And Building Envelope Thereof.
Inventors include Begue, Olivier International Bureau; Vignal, Renaud; and Descazeaux, Mdric Intellectual.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: The invention relates to a sandwich panel comprising a photovoltaic active area positioned on the outer sheet and whose upper, respectively lower, electrical connector is positioned in an upper, respectively lower, cavity, the upper cavity being positioned within the insulation material in the upper half of the sandwich panel, the lower cavity being positioned within the insulation material in the lower half of the sandwich panel, the upper cavity and the lower cavity being adjacent to a longitudinal groove in the inner central part of the inner sheet and being either both adjacent to the first longitudinal side of the insulation material or both adjacent to the second longitudinal side of the insulation material so that the first upper respectively lower, electrical connector can be accessed from the upper, respectively lower, cavity along one longitudinal side of the insulation material and can be connected through the longitudinal groove.
Disclaimer: Curated by HT Syndication.
