MUMBAI, India, July 7 -- Intellectual Property India has published a patent application (202617069747 A) filed by Arcelormittal on June 03, 2026, for Sandwich Panel And Building Envelope Thereof.
Inventors include Begue, Olivier; Vignal, Renaud Intellectual; and Descazeaux, Mdric.
The application for the patent was published on July 03, 2026, under issue no. 27/2026.
Abstract: The invention relates to a process for manufacturing a sandwich panel comprising a photovoltaic active area positioned on the outer sheet and whose upper, respectively lower, electrical conductor is connected to an upper, respectively lower, cable at the backside of the outer sheet, the process comprising positioning the outer sheet in a mold, inserting a downstream portion of the upper, respectively lower, cable with the upper, respectively lower, electrical connector either in a hole in one of the sides of the mold or in a groove formed in the inner sheet, putting insulation in place and maintaining the inner sheet at a given distance from the outer sheet.
Disclaimer: Curated by HT Syndication.
