MUMBAI, India, June 24 -- Intellectual Property India has published a patent application (202617060792 A) filed by International Business Machines Corporation on May 13, 2026, for Semiconductor Structures With Multi-Stage Vias.
Inventors include Senapati, Biswanath; Khan, Shahrukh; Bajpai, Utkarsh; Xie, Ruilong; Seshadri, Indira; and Yamashita, Tenko.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: A method includes forming a first stage of a multi-stage via in a semiconductor structure utilizing processing from a first side of the semiconductor structure, the first stage of the multi-stage via having a first surface and a second surface opposite the first surface. The method also includes forming a second stage of the multi-stage via utilizing processing from a second side of the semiconductor structure, the first stage of the multi-stage via having a first surface and a second surface opposite the first surface. The first surface of the first stage of the multi-stage via is proximate the first side of the semiconductor structure, the first surface of the second stage of the multi-stage via is proximate the second side of the semiconductor structure, and the second surface of the first stage of the multi- stage via abuts the second surface of the second stage of the multi-stage via.
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