MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647087050 A) filed by Asml Netherlands B. V. on July 16, 2026, for Sensor And Method For Qualification Of A Topography Of A Surface Of A Die For Die Bonding.
Inventors include De Jager, Pieter, Willem, Herman; Schouten, Christine, Henriette; Dolk, Victor, Sebastiaan; Wahbeh, Lotfi; Assendelft, Joep; Bustraan, Krijn, Frederik; Sahin, Buket; Alleleijn, Joep, Hanni, Hub, Maria; Broers, Sander, Christiaan; and Venugopalan, Syam, Parayil.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: A system for die bonding comprising a sensor configured to determine a characteristic of a topography of a surface of one or more semiconductor dies, the sensor comprising: a radiation emission system configured to emit radiation having a substantially flat wavefront; and a radiation detector configured to detect at least some of the radiation after reflection by the one or more semiconductor dies to determine the characteristic of one or more semiconductor dies, wherein the system is configured to, based on output of the sensor, either: 1) accept and/or reject a semiconductor die for die bonding, or 2) reposition a semiconductor die and/or output the semiconductor die for cleaning prior to bonding.
Disclaimer: Curated by HT Syndication.
