MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647074653 A) filed by Qualcomm Incorporated on June 16, 2026, for Sensor-Based Ultrasonic Coupling Layer Evaluation And Related User Interface Functionality.
Inventors include Mcquillan, Kaylin; Buchan, Nicholas; Gojevic, Stephen Michael; Tseng, Chin-Jen; Badge, Ila; Brooks, Emily Kathryn; Zhan, Ye; and Schneider, John Keith.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: Some disclosed methods involve controlling an apparatus that includes an ultrasonic receiver system. Some such methods involve receiving ultrasonic sensor data from the ultrasonic receiver system and detecting, based at least in part on the ultrasonic sensor data, one or more imperfections in, on or proximate an adhesive ultrasonic coupling layer on an outer surface of the apparatus. Some such methods involve controlling a user interface system to provide a prompt to adjust or replace the adhesive ultrasonic coupling layer responsive to detecting the one or more imperfections in, on or proximate the adhesive ultrasonic coupling layer.
Disclaimer: Curated by HT Syndication.
