MUMBAI, India, June 22 -- Intellectual Property India has published a patent application (202641055418 A) filed by Iinvsys Private Limited on April 30, 2026, for Smart Electrical Switch Socket Assembly With Integrated Temperature Sensor.
Inventors include Gunasegeran, Muthukumaran; and Govindassamy, Sivakumar.
The application for the patent was published on June 12, 2026, under issue no. 24/2026.
Abstract: The present invention provides a smart electrical switch socket assembly (100) comprising a bottom enclosure (1) and top enclosure (18) forming a closed housing containing conductive pins (2, 3), a PCB (6) with integrated smart electronics, and a shutter mechanism (11) guided by a slot (10) formed directly in the PCB (6). The assembly includes a wing slider (13) that converts force from plug insertion or power button (4) operation into linear shutter motion, with a spring (16) providing return force. An NTC temperature sensor (20) is positioned through a dedicated mating hole (21) to place the sensing element in direct thermal contact with high-current regions for continuous temperature monitoring and thermal shutdown protection. The PCB-defined shutter guide slot eliminates tolerance stack-up from enclosure-only channels, providing lifetime alignment precision, while the integrated thermal probe enables intelligent overload protection absent in conventional socket assemblies. (Figure. 1)
Disclaimer: Curated by HT Syndication.
