MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202641085134 A) filed by Sai Vidya Institute Of Technology on July 11, 2026, for Smart Label Sensor For Perishable Food Package.
Inventors include Dr. Manjunath T N G; Dr. Nagashree N; Prof. Pavithra B; Prof. Luwina P; Dinesh Kumar M; Lakshmi K N; G Sohith Reddy; and Harsha H K.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: The present invention relates to a Student Skill Exchange Platform for enabling structured peer-to-peer learning among students through digital skill discovery, matching, scheduling, and feedback mechanisms. The platform allows verified student users to list skills they can teach, request skills they wish to learn, and participate in reciprocal or credit-based exchange sessions. By integrating student authentication, skill profiling, recommendation logic, scheduling tools, and reputation features, the invention provides an organized, scalable, and institution-friendly framework for collaborative learning. The platform improves access to knowledge, encourages community participation, supports practical skill development, and enhances student engagement across academic and extracurricular domains.
Disclaimer: Curated by HT Syndication.
