MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617094241 A) filed by Senju Metal Industry Co. , Ltd. on August 04, 2026, for Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, On-Vehicle Electronic Circuit, Ecu Electronic Circuit, On-Vehicle Electronic Circuit Device, And Ecu Electronic Circuit Device.
Inventors include Iijima Yuki; and Yokoyama Takahiro.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: The present invention provides a solder alloy, a solder paste, a solder ball, a solder preform, a solder joint, an on-vehicle electronic circuit, an ECU electronic circuit, an on-vehicle electronic circuit device, and an ECU electronic circuit device that have a low melting point, have high shear strength, exhibit an appropriate fracture mode, and have excellent heat cycle resistance. The solder alloy has an alloy composition comprising, in mass%, 2.0-3.6% Ag, 0.6-0.9% Cu, 1.0-5.0% In, 3.0-5.0% Sb, 0.0010-0.0300% Fe, and 0.0010-0.0500% Co, with the remainder being Sn. Preferably, the alloy composition further contains, in mass%, at least one of Zr, Ge, Ga, P, As, Pb, Zn, Mg, Cr, Ti, Mo, Pt, Pd, Au, Al, and Si in a total amount of 0.100% or less.
Disclaimer: Curated by HT Syndication.
