MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617095626 A) filed by Senju Metal Industry Co. , Ltd. on August 07, 2026, for Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, On-Vehicle Electronic Circuit, Ecu Electronic Circuit, On-Vehicle Electronic Circuit Device, And Ecu Electronic Circuit Device.
Inventors include Iijima Yuki; and Yokoyama Takahiro.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: Provided are: a solder alloy having a low melting point, a high shear strength, and a suitable fracture mode; a solder paste; a solder ball; a solder preform; a solder joint; an on-vehicle electronic circuit; an ECU electronic circuit; an on-vehicle electronic circuit device; and an ECU electronic circuit device. This solder alloy has an alloy composition comprising, in terms of mass%, 2.0-3.6% Ag, 1.0-5.0% In, 3.0-5.0% Sb, 0.001-0.030% Fe, and 0.0000-0.0500% Co, inclusive, with the remainder being Sn. Preferably, this alloy composition also contains at least one element from among Zr, Ge, Ga, P, As, Pb, Zn, Mg, Cr, Ti, Mo, Pt, Pd, Au, Al, and Si at a total amount of 0.100% or less in terms of mass%.
Disclaimer: Curated by HT Syndication.
