MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202411096731 A) filed by Mercedes-Benz Group AG on December 06, 2024, for Spoiler Assembly And Method Of Operating The Spoiler Assembly For A Vehicle.
Inventors include Soham Salunkhe; and Naga Yadala.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: A spoiler assembly 10 for a vehicle is provided. The spoiler assembly 10 comprising a spoiler plate assembly 100 that comprises a spoiler carrier plate assembly 220 with a plurality of carrier plates forming an integrated carrier plate, and a spoiler blade assembly 210 with a plurality of blades attached to corresponding carrier plates. The spoiler plate assembly 100 allows lifting of the integrated carrier plate or any one of a carrier plate from the plurality of carrier plates 224a, 224b with corresponding blades 214a, 214b from a resting position to a lifted position based on aerodynamic vehicle conditions. The spoiler carrier plate assembly 220 and the spoiler blade assembly 210 is a three-piece configuration. The configuration of the spoiler plate assembly 100 creates a targeted downforce to improve stability and handling during vehicle cornering. [FIG. 2]
Disclaimer: Curated by HT Syndication.
