MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617096605 A) filed by Multisorb Technologies, Inc. on August 10, 2026, for Structure And Method For Environmentally Friendly Blister Packaging.
Inventor includes Dontula, Narasimharao.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: A sustainable, environmentally-friendly structure and method for blister packaging comprising, in certain aspects, one or more active moisture barrier layer including a first moisture absorbing composition and a COC, and one or more passive moisture barrier layers. The multilayer structure may be asymmetric, with active layers in a coextruded structure of different thicknesses, for example. A method of forming a sustainable moisture absorbing multilayer structure includes formation of a base structure including one or more first passive moisture barrier layers, and one or more active moisture barrier layers. In certain aspects, the composite density of the multilayer structure is lower than commercially available structures. In other aspects, non-halogenated, environmentally-friendly materials are utilized in various or all layers.
Disclaimer: Curated by HT Syndication.
