MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088269 A) filed by Qualcomm Incorporated on July 20, 2026, for Substrate With Buried Glass Core.
Inventors include We, Hong Bok; Buot, Joan Rey Villarba; and Kang, Kuiwon.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: In an aspect, an IC device may include a substrate including a copper clad laminate (CCL) core and a glass block at least partially embedded in the CCL core; a first metallization structure including a plurality of first dielectric layers; a plurality of first metal layers; and a plurality of first vias configured to couple adjacent metal layers of the plurality of first metal layers through the plurality of first dielectric layers; and a second metallization structure comprising a plurality of second dielectric layers, a plurality of second metal layers and a plurality of second vias, wherein the second metallization structure is disposed on a second side of the substrate opposite the first metallization structure disposed on a first side of the substrate.
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