MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202648071395 A) filed by Qualcomm Incorporated on June 09, 2026, for Superposition Transmission Of Sidelink And Uplink.
Inventors include Balasubramanian, Anantharaman; Wu, Shuanshuan; Gulati, Kapil Number; and Baghel, Sudhir Kumar.
The application for the patent was published on July 10, 2026, under issue no. 28/2026.
Abstract: A base station in a wireless communication network, comprising: means for communicating with a first wireless communication device over a first link on a common carrier shared between the first link and a second link on which the first wireless communication device further communicates with a second wireless communication device; means for transmitting a grant to the first wireless communication device comprising an indication of resources on the common carrier for a superposition transmission comprising a base layer corresponding to an uplink signal to be transmitted from the first wireless communication device to the base station and an enhanced layer corresponding to a sidelink signal to be transmitted from the first wireless communication device to at least the second wireless communication device; and means for receiving the base layer of the superposition transmission comprising the uplink signal from the first wireless communication device.
Disclaimer: Curated by HT Syndication.
