MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202647096298 A) filed by Rf Singapore Pte. Ltd. on August 10, 2026, for Surface Acoustic Wave (saw) Device With High-Dielectric-Constant Material.
Inventors include Jewula, Tomasz; and Raab, Nicolas.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Certain aspects of the present disclosure are directed towards a SAW device (100). The SAW device may include a piezoelectric layer (102); an interdigital transducer (IDT) (104) disposed above the piezoelectric layer and comprising a first electrode finger (404a) and a second electrode finger (404b); and a first high-dielectric- constant (high-K) (410) material disposed between the first electrode finger and the second electrode finger, wherein a height of the first high-x material above the piezoelectric layer is more than 60% of a height of the first electrode finger or the second electrode finger above the piezoelectric layer.
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