MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617084208 A) filed by Enkorp LLC on July 09, 2026, for System, Method, And Device For Temperature Management.
Inventors include Aguayo, Matthew J.; and Arora, Aashay.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: Systems, methods, and devices for temperature management are disclosed. The temperature management system may include a multilayered thermal barrier system. The thermal barrier system includes a thermally reflective material layer, a material having a low thermal conductivity layer, and a phase change material. The layers may be applied as a fluid.
Disclaimer: Curated by HT Syndication.
