MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647087668 A) filed by Asml Netherlands B. V. on July 17, 2026, for System And Method For Stress Release In Die Bonding.
Inventors include Van Den Brink, Marinus, Aart; Beukman, Arjan, Johannes, Anton; and Sokolov, Sergei.
The application for the patent was published on July 24, 2026, under issue no. 30/2026.
Abstract: A system comprising: a targeted emission system configured to induce stress features in a semiconductor die; and a processor system configured to: obtain a pattern of stress features, the pattern of stress features configured to alter a distortion of the semiconductor die; and cause the targeted emission system to generate stress features in the semiconductor die based on the pattern of stress features, wherein the targeted emission system comprises a femtosecond laser system, wherein the semiconductor die is a semiconductor die bonded to a further semiconductor die and wherein the distortion is caused, at least in part, by stress induced by the bonding.
Disclaimer: Curated by HT Syndication.
