MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202347041197 A) filed by Iceotope Group Limited on June 16, 2023, for System For Cooling Electronic Devices In An Electronic Module.
Inventors include Matteson, Jason; Edmunds, Neil; Amos, David; Page, William; Longhurst, Nathan; Kadhim, Mustafa; and Kidger, Jasper.
The application for the patent was published on June 26, 2026, under issue no. 26/2026.
Abstract: A system for cooling a plurality of electronic devices, having a first cooling circulatory arrangement, configured to cause a first liquid coolant to circulate between a first electronic device and a heat exchanger, wherein the first electronic device is thermally coupled to the first liquid coolant. The system also has a second cooling circulatory arrangement, configured to cause a second liquid coolant to flow through the heat exchanger, and to cause the second liquid coolant to flow through a cooling module thermally coupled to a second electronic device. The first cooling circulatory arrangement and the second cooling circulatory arrangement are thermally coupled via the heat exchanger, such that the heat exchanger is configured to transfer heat from the first liquid coolant to the second liquid coolant.
Disclaimer: Curated by HT Syndication.
