MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202617090719 A) filed by Terrapower, LLC on July 25, 2026, for Tag Gas Capsule With Thermally Based Release System.
Inventors include Choi, Joonhyung; Deleo, Francesco; Geideman, Curt; Moore, Jason R; Moyles, Kevin; and Romero, Javier.
The application for the patent was published on October 23, 2026, under issue no. 43/2026.
Abstract: A tag gas capsule utilizes a thermally based release system to allow the tag gas to flow through a fuel pin and to be detectable upon a leak in the fuel pin. A tag gas capsule is fabricated that has an escape pathway for the tag gas wherein the escape pathway is sealed by a thermally sensitive material. During fabrication, the thermally sensitive material is melted into the tag gas capsule and seals a flow hole in the tag gas capsule. The capsule is then filled with a tag gas and sealed to prevent escape of the tag gas. Once the capsule has been installed into a fuel pin, the capsule can be heated to melt the thermally sensitive material and expose the flow hole. The tag gas can then flow out of the flow hole and into the fuel pin.
Disclaimer: Curated by HT Syndication.
