MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202611064720 A) filed by Sabyasachi Bhattacharya on May 22, 2026, for Temp Resist.
Inventor includes Sabyasachi Bhattacharya.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: The object to be stored got to be packed by putting in a box with two layers separated by minimum 5mm totally made of bad conductor of heat. The outer layer made of hard object like cardboard and the inner layer preferably made of thin object like paper etc covered by silver color and protected from moisture. The separation may be done using any hard, light weight and bad conductor of heat. Now the gap between the layers must be vacuumed and sealed. This should cover the material to be stored from all direction and air tight, I mean once packed outside air should not be able to touch the object. It is understood that the temperature of the object to be stored must be taken to desired temperature before box up.
Disclaimer: Curated by HT Syndication.
