MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617093869 A) filed by Mitsubishi Materials Corporation on August 03, 2026, for Terminal Material For Connector, Method For Manufacturing Same, And Connector.
Inventors include Kitano, Mana; Maeda, Koya; Sosa, Hironobu; and Tarutani, Yoshie.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: In the present invention, a coating film is formed on a surface of a substrate made of copper or a copper alloy. The coating film comprises: a nickel layer that is composed of nickel or a nickel alloy and is formed on the surface of the substrate; a copper-tin alloy layer that is composed of an alloy of copper and tin and is formed on the nickel layer; and a tin layer that is composed of tin or a tin alloy and is formed on the copper-tin alloy layer. The average thickness of the nickel layer is 0.05 µm to 3.00 µm, the arithmetic mean peak curvature Spc of the surface of the copper-tin alloy layer is 700 mm-1 to 2200 mm-1, the average thickness of the tin layer is 0.05 µm to 2.00 µm, and the average thickness of the copper-tin alloy layer is 0.15 µm to 1.55 µm.
Disclaimer: Curated by HT Syndication.
