MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202617035438 A) filed by Lg Chem, Ltd. on March 24, 2026, for Thermoplastic Resin Composition, Method For Preparing Same, And Molded Article Comprising Same.
Inventors include Park, Chun Ho; Kim, Seo Hwa; Cho, Yun Kyoung; An, Yong Hee; Kim, Ho Hoon; Jang, Jeongmin; and Hwang, Hyeri.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: The present disclosure relates to a thermoplastic resin composition, a method for preparing same, and a molded article comprising same and, more specifically, to a thermoplastic resin composition, a method for preparing same, and a molded article comprising same, the thermoplastic resin composition comprising: (A-1) 4 to 31 wt% of an alkyl acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer containing an alkyl acrylate rubber having an average particle diameter of 50 to 150 nm; (A-2) 1 to 22 wt % of an alkyl acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer containing an alkyl acrylate rubber having an average particle diameter of 150 nm (exclusive) to 600 nm (inclusive); (B) 55 to 77 wt% of an aromatic vinyl compound-vinyl cyanide compound copolymer; (C) 7 to 12.5 wt % of a white pigment; and (D) 3.5 to 8 wt% of a white pigment auxiliary agent having an average particle size of 2 µm or less. According to the present invention, a thermoplastic resin composition, a method for preparing same, and a molded article comprising same can be provided wherein the thermoplastic resin composition maintains excellent physical properties of a conventional ASA-based resin, implements high whiteness even with a reduced input amount of a white pigment, exhibits excellent thin film processability, hiding power, and glossiness, displays superior appearance quality due to the absence of protrusions on a surface, and reduces manufacturing costs.
Disclaimer: Curated by HT Syndication.
