MUMBAI, India, Aug. 17 -- Intellectual Property India has published a patent application (202617078521 A) filed by Oneness Biotech Co. , Ltd. on June 25, 2026, for Topical Formulation For Wound Healing.
Inventors include Lu, Kung-Ming; Cheng, Hui-Ling; and Chen, Chou-Hsiung.
The application for the patent was published on August 14, 2026, under issue no. 33/2026.
Abstract: A topical formulation comprising a Plectranthus amboinicus (PA) extract, a Centella asiatica (CA) extract, a moisture-retaining polymeric biomaterial, and a pharmaceutically effective excipient. The present disclosure also relates to the use of the topical formulation for promoting wound healing.
Disclaimer: Curated by HT Syndication.
