MUMBAI, India, Oct. 5 -- Intellectual Property India has published a patent application (202521015346 A) filed by Rungta International Skills University; Rungta College Of Engineering & Technology; and Rungta College Of Pharmaceutical Sciences And Research on February 22, 2025, for Ultra-Lightweight Metamaterial 3d Base Frames For High-Performance Structural Applications.
Inventor includes Dr. Sanjeev Shukla.
The application for the patent was published on October 02, 2026, under issue no. 40/2026.
Abstract: Ultra-Lightweight Metamaterial 3D Base Frames for High-Performance Structural Applications This invention describes an Ultra-Lightweight Metamaterial 3D Base Frames integrate metamaterial principles with topology optimization to revolutionize structural frameworks. Featuring lattice and honeycomb geometries, these frames achieve an exceptional strength-to-weight ratio, significantly reducing material usage while maintaining structural integrity. Utilizing advanced 3D printing, they offer precision fabrication, cost efficiency, and minimal waste. The modular design ensures efficient load distribution, ease of transport, and simplified assembly. Compatible with lightweight materials like aluminum, titanium alloys, and advanced composites, these frames adapt to applications in aerospace, automotive, and construction industries. Unlike conventional solid, heavy frames that increase construction costs and logistic challenges, these optimized structures enable superior durability, flexibility, and sustainability. Their lightweight yet robust design enhances transportation efficiency and installation, providing a cost-effective alternative to traditional base frames. This breakthrough innovation ensures a durable, scalable, and logistically efficient solution for modern engineering applications.
Disclaimer: Curated by HT Syndication.
