MUMBAI, India, July 24 -- Intellectual Property India has published a patent application (202647085551 A) filed by Henkel AG & Co. Kgaa on July 13, 2026, for Underfill Composition.
Inventors include Hu, Wei; Yao, Wei; and Huang, Chenyu.
The application for the patent was published on July 17, 2026, under issue no. 29/2026.
Abstract: An underfill composition is provided, said underfill composition comprising: (a) an epoxy component comprising: (a-1) an epoxy monomer of formula (I) : wherein n is 2, 3 or 4; and R is selected from a n-valent benzene group, a n-valent naphthalene group and a n-valent anthracene group; (a-2) a liquid epoxy resin having at least two glycidoxy groups per molecule; (b) an amine curing agent; (c) a non-conductive inorganic filler; (d) a coupling agent; and (e) optionally, an additive; wherein when R is a n-valent benzene group, the epoxy monomer of formula (I) is comprised in the composition in an amount of less than 10 wt%, when R is a n-valent naphthalene group or a n-valent anthracene group, the epoxy monomer of formula (I) is comprised in the composition in an amount of less than 5 wt%, each wt% is based on the total weight of the underfill composition. A flip chip packaged by said underfill composition is also provided.
Disclaimer: Curated by HT Syndication.
