MUMBAI, India, Aug. 10 -- Intellectual Property India has published a patent application (202511000522 A) filed by Schneider Electric India Private Limited on January 02, 2025, for Variable Thermal Arrangement For Molded Case Circuit Breakers (mccbs).
Inventor includes Behera, Subrat Kumar.
The application for the patent was published on July 31, 2026, under issue no. 31/2026.
Abstract: The present disclosure relates to a circuit breaker (100) that includes a release assembly (110) mounted to a housing (102), with a variable thermal arrangement configured to trip the circuit breaker upon detecting an overload condition. A mechanism assembly (114) operably coupled to the release assembly (110) receives a tripping signal and mechanically actuates disconnection of an electrical circuit. A thermal setting knob (112) rotatably mounted on the housing’s main cover (104), adjusts the thermal arrangement to vary the thermal trip threshold between minimum and maximum temperature change conditions. A trip plate assembly (116) includes a trip slider (108) coupled to the thermal setting knob, which moves in response to the set temperature change, and a trip plate (118) executing linear movement along a sloped configuration, actuating the circuit breaker to disconnect power and prevent damage when the temperature reaches the set threshold.
Disclaimer: Curated by HT Syndication.
