MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202611070153 A) filed by Noida International University on June 04, 2026, for Waam-Based Investigation Of Refractory Bimetallic Structures.
Inventors include Vijay Kumar; Sunil Thakur; Piyush Pal; and Rahul Kumar Singh.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: The invention relates to investigation of 3D printed refractory bimetallic structures using Wire Arc Additive Manufacturing. Refractory bimetallic structures are difficult to fabricate and evaluate due to high-temperature material behaviour, layer-wise deposition effects, and interface formation between dissimilar refractory metals. The disclosed method comprises feeding first and second refractory wires, depositing the wires by WAAM, forming a refractory bimetallic structure, preparing characterization samples, and evaluating interface formation, deposited layers, microstructure, and mechanical properties. The system comprises first and second wire feed units, a WAAM deposition unit, a substrate, a refractory bimetallic structure, and a characterization and analysis unit. The invention is useful for aerospace, defence, energy, tooling, research laboratories, and high-temperature component manufacturing sectors.
Disclaimer: Curated by HT Syndication.
