MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202617094816 A) filed by Sumitomo Seika Chemicals Co. , Ltd. on August 05, 2026, for Water-Absorbing Resin Particle Production Method And Water-Absorbing Resin Particle.
Inventor includes Nishi, Hideyuki.
The application for the patent was published on October 30, 2026, under issue no. 44/2026.
Abstract: Provided is a water-absorbing resin particle production method with which water-absorbing resin particles exhibiting less cracking with respect to collision are obtained, and which comprises a step for carrying out inverse suspension polymerization of a water-soluble ethylenically unsaturated monomer in a hydrocarbon dispersion medium to obtain polymer particles. This water-absorbing resin particle production method comprises a step for carrying out inverse suspension polymerization of a water-soluble ethylenically unsaturated monomer in a hydrocarbon dispersion medium to obtain polymer particles. The inverse suspension polymerization is performed in multiple stages including at least two stages. The method further comprises a step for aggregating the polymer particles in the presence of a dispersion stabilizer. As the dispersion stabilizer, at least a (poly)glycerin fatty acid ester and a sugar-based nonionic surfactant are used.
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