MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202541008809 A) filed by Jain Deemed-To-Be University on February 03, 2025, for Wearable Soldering Device.
Inventor includes Vinay Kumar S B.
The application for the patent was published on August 07, 2026, under issue no. 32/2026.
Abstract: A wearable soldering device, comprises of a platform 101 configured with a drawer mechanism 102 to extend or retract the platform 101 and a plurality of hinges 103 to wrap around the hand of the user, a motorized roller 104 stores spool of soldering wick, a clamp 105 for holding the soldering wick from the roller 104, L-shaped telescopic rod 106 by a ball and socket joint extends/retracts the plate 201 having plurality of pivot joints 202 enables the plate 201 to wrap around a finger of the user, clipper 203 supports an end of the soldering wick, an artificial intelligence-based imaging unit 107 for recording and processing images in a vicinity of the platform 101, an L-shaped telescopic link 108 having a magnifying lens 109 enables the user for performing minute soldering work, and a microphone for receiving an audio command from the user regarding dispensing soldering wick.
Disclaimer: Curated by HT Syndication.
