MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647126942 A) filed by Mastercard International Incorporated on October 24, 2026, for Method And System Of Simplified Settlement Between Issuers Using Blockchain Technology. Inventors include Bagul, Prathamesh, Bhagwan; Ghadiyaram, Uday, Kiran; and Kadge, Vaibhav. The application for the patent was published on October 30, 2026, under issue no. 44/2026. Abstract: A method for performing simplified net s...
MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647126943 A) filed by Mastercard International Incorporated on October 24, 2026, for Method And System Of Platform Agnostic Data Quality Solution Using Hybrid Of Edge Computing And Blockchain Technology. Inventors include Handa, Ambika; and Marwaha, Lakshay. The application for the patent was published on October 30, 2026, under issue no. 44/2026. Abstract: A method for enhancing security, reliability,...
MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647126944 A) filed by Mastercard International Incorporated on October 24, 2026, for Method And System Using Loyalty Coins As Digital Currency With Smart Contracts. Inventors include Mahajan, Mrinal; Majhi, Arnesh; Shamnani, Bharat; Naik, Himanshu; and Jain, Samta. The application for the patent was published on October 30, 2026, under issue no. 44/2026. Abstract: A method for implementing loyalty poin...
MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647126945 A) filed by Mastercard International Incorporated on October 24, 2026, for Method And System For Non-Fungible Token Validation For Enabling Payment Account Transaction Blocking. Inventors include Abreu, Eduardo; Senci, David, J.; and Williams, Kyle. The application for the patent was published on October 30, 2026, under issue no. 44/2026. Abstract: A method for account and transaction blockin...
MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647126980 A) filed by Cisco Technology, Inc. on October 25, 2026, for Key Generation For Seamless Roaming. Inventors include Gupta, Binita; Orr, Stephen M.; and Hart, Brian D.. The application for the patent was published on October 30, 2026, under issue no. 44/2026. Abstract: A seamless mobility domain (SMD) is described where a PTK for a wireless device is pre-computed or pre-generated before the cli...
MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647127156 A) filed by Tetra Laval Holdings & Finance S. A. on October 26, 2026, for Sealing Unit For Sealing A Tube Of Packaging Material For The Production Of Packages Containing A Pourable Product. Inventors include Ferrari, Claudio; Ghirardello, Roberto; and Marsella, Angelo. The application for the patent was published on October 30, 2026, under issue no. 44/2026. Abstract: There is described a sea...
MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647127161 A) filed by Qualcomm Incorporated on October 26, 2026, for Phase Vector Compression With Polar Codes. Inventors include Wu, Liangming; Wei, Chao; Yang, Wei; and Jiang, Jing. The application for the patent was published on October 30, 2026, under issue no. 44/2026. Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a wireless commun...
MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647127165 A) filed by Tetra Laval Holdings & Finance S. A. on October 26, 2026, for A Laminated Packaging Material. Inventors include Shahid, Nouraiz; Bjrup, Niclas; Hakansson, Jonas; Ohlsson, Erling; and Robertsson, Dan. The application for the patent was published on October 30, 2026, under issue no. 44/2026. Abstract: A laminated packaging material (16) for packaging of liquid food products is provi...
MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647127190 A) filed by Dowa Metaltech Co. , Ltd. on October 26, 2026, for Copper Alloy Sheet Material, Current-Carrying Component, Heat Dissipation Component, And Board- To-Board Connector. Inventor includes Hyodo Hiroshi. The application for the patent was published on October 30, 2026, under issue no. 44/2026. Abstract: Provided is a copper alloy sheet material having a chemical composition of, in mas...
MUMBAI, India, Nov. 2 -- Intellectual Property India has published a patent application (202647127195 A) filed by Toyo Seikan Group Holdings, Ltd. on October 26, 2026, for Porous Silica Doped With Multiple Types Of Metals And Containing High Copper Content. Inventors include Kimura Samizo Mariko; Ikeda Kazuho; Yagami Genta; Ohashi Kazuaki; and Ikutame Daisuke. The application for the patent was published on October 30, 2026, under issue no. 44/2026. Abstract: The present invention addresses t...