MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081569 A) filed by Henkel AG & Co. Kgaa on July 02, 2026, for Two-Part Epoxy Coating Composition. Inventors include Li, Bin; Chu, Hongyu; Chen, Chunfu; and Lu, Daoqiang. The application for the patent was published on July 10, 2026, under issue no. 28/2026. Abstract: A two-part epoxy coating composition is provided, comprising a first part and a second part, the first part comprising: i) an epoxy r...
MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081590 A) filed by Ciena Corporation on July 02, 2026, for Detecting Segment Expansion Changes In Segment Routing Using Dynamic Shortest Path First. Inventors include Defilippi, Todd; and Alaettinoglu, Cengiz. The application for the patent was published on July 10, 2026, under issue no. 28/2026. Abstract: Systems and methods for detecting segment expansion changes in Segment Routing using Dynamic ...
MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081607 A) filed by Quectel Wireless Solutions Co. , Ltd. on July 02, 2026, for Wireless Communication Method And Communication Device. Inventor includes Huang, Qufang. The application for the patent was published on July 10, 2026, under issue no. 28/2026. Abstract: Provided are a wireless communication method and a communication device. The method comprises: a first terminal device receives a first...
MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081608 A) filed by Danieli & C. Officine Meccaniche S. P. A.; and Hyl Technologies, S. A. De C. V. on July 02, 2026, for Direct Reduction Plant And Process Thereof. Inventors include Tavano, Andrea; Lapasin, Marco; Maggiolino, Stefano; and Martinez Miramontes, Jorge Eugenio Number. The application for the patent was published on July 10, 2026, under issue no. 28/2026. Abstract: A direct reduction p...
MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081619 A) filed by Henkel AG & Co. Kgaa on July 02, 2026, for Electrochemically Debondable Adhesive Film. Inventors include Stricker, Lucas; Sweeney, Nigel; Huehnergarth, Philipp; Haberlin, Gavin; Stapf, Stefanie Number; and Mantout, Lola. The application for the patent was published on July 10, 2026, under issue no. 28/2026. Abstract: The present disclosure is directed to a curable and electrochem...
MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081623 A) filed by Qualcomm Incorporated on July 02, 2026, for Network-Assisted Daa For Aerial Ues. Inventors include Faccin, Stefano; Van Duren, Drew Foster; and Kim, Sunghoon Number. The application for the patent was published on July 10, 2026, under issue no. 28/2026. Abstract: Network-assisted DAA for AUEs is described. An apparatus is configured to establish a connection with a mobile network...
MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081650 A) filed by Qualcomm Incorporated on July 02, 2026, for Signaling For Activation And Deactivation Of Discontinuous Communications. Inventors include Ma, Liangping; Ly, Hung Dinh; Wang, Xiao Feng Number; and Rico Alvarino, Alberto. The application for the patent was published on July 10, 2026, under issue no. 28/2026. Abstract: Certain aspects of the present disclosure provide techniques for ...
MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081652 A) filed by Dai Nippon Printing Co. , Ltd. on July 02, 2026, for Blow Molding Machine Operation Condition Inference Device, Method, And Program, And Learning Device. Inventors include Kato Hirohisa; Hirose Kazuya; Sekine Akitomo; Taguchi Kazuya Number; and Nakajima Hirofumi. The application for the patent was published on July 10, 2026, under issue no. 28/2026. Abstract: A trained model 73 w...
MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081657 A) filed by Nokia Technologies Oy on July 02, 2026, for Requesting Desired Data Rate. Inventors include Rout, Bivudendu Pratap; Dalsgaard, Lars; Henttonen, Tero; Li, Zexian; and K, Sudheendra Number. The application for the patent was published on July 10, 2026, under issue no. 28/2026. Abstract: Disclosed is a method comprising generating an access stratum message comprising at least a requ...
MUMBAI, India, July 13 -- Intellectual Property India has published a patent application (202647081662 A) filed by Entegris, Inc. on July 02, 2026, for High Clamp Force Electrostatic Chuck For Non-Flat Substrates. Inventors include Donnell, Steven; Parker, Isaac J.; Minsky, Caleb; and Rybczynski, Jakub Number. The application for the patent was published on July 10, 2026, under issue no. 28/2026. Abstract: An electrostatic chuck includes an electrode and a dielectric layer. When a voltage is ...