MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058660 A) filed by Oracle International Corporation on May 08, 2026, for Global Virtual Planes. Inventors include Brar, Jagwinder Singh; and Becker, David Dale. The application for the patent was published on June 26, 2026, under issue no. 26/2026. Abstract: A network environment comprises a plurality of host machines that are communicatively coupled to each other via a network fabric comprising a ...
MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058676 A) filed by Telefonaktiebolaget Lm Ericsson Publ on May 08, 2026, for Method For Reporting Performance Related Information Associated To A Computational Model For Predicting Channel State Information. Inventors include Pradhan, Chandan; Li, Jingya; Shubhi, Ilmiawan; Andgart, Niklas Number; Zhang, Xinlin; and Muruganathan, Siva. The application for the patent was published on June 26, 2026, un...
MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058697 A) filed by Micro Motion, Inc. on May 08, 2026, for Coriolis Flowmeter With External Magnetic Field Detection And Related Method. Inventors include Vanhorn, Alec Blain; and Pankratz, Anthony William. The application for the patent was published on June 26, 2026, under issue no. 26/2026. Abstract: A Coriolis flowmeter (5) and related method is provided. A pickoff zero (POzero) is measured dur...
MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058705 A) filed by Oracle International Corporation on May 08, 2026, for Techniques Of Achieving End-To-End Traffic Isolation. Inventors include Uecker, Jacob Robert; and Brar, Jagwinder Singh. The application for the patent was published on June 26, 2026, under issue no. 26/2026. Abstract: Discussed herein is a mechanism of building/constructing a network fabric for a cluster of GPUs. A plurality ...
MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058714 A) filed by Henkel AG & Co. Kgaa on May 08, 2026, for Thermally Conductive Silicone Adhesive Composition. Inventors include Zhu, Xingyu; Xie, Dan; Chen, Xiaodan; and Chen, Yan. The application for the patent was published on June 26, 2026, under issue no. 26/2026. Abstract: The present invention relates to a thermally conductive silicone adhesive composition comprising: (A) an alkenyl group-...
MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058747 A) filed by Oracle International Corporation on May 08, 2026, for Interconnection Of Global Virtual Planes. Inventors include Brar, Jagwinder Singh; Becker, David Dale; Shetty, Nikhil; and Kundu, Partha. The application for the patent was published on June 26, 2026, under issue no. 26/2026. Abstract: A network environment comprises a plurality of host machines that are coupled to each other ...
MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058795 A) filed by Vlinge Innovation Ab on May 08, 2026, for Mechanical Locking Device For Building Panels. Inventor includes Nilsson, Anders. The application for the patent was published on June 26, 2026, under issue no. 26/2026. Abstract: A set of building panels (1, 1', 1'') such as floor panels, including similar or essentially identical building panels (1, 1', 1''). Each building panel (1, 1',...
MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058814 A) filed by Qualcomm Incorporated on May 08, 2026, for Wake-Up Signal Configurations Via Sidelink Channels. Inventors include Ly, Hung Dinh; Mukkavilli, Krishna Kiran; and Abotabl, Ahmed Attia. The application for the patent was published on June 26, 2026, under issue no. 26/2026. Abstract: Some communications systems include one or more cells that provide on-demand signaling for network ene...
MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058815 A) filed by Qualcomm Incorporated on May 08, 2026, for Package Substrate With Embedded Capacitor Package Having Redistribution Layer(s) (rdl(s)) For Aligning Capacitor Terminals Connections To Semiconductor Die In An Integrated Circuit (ic) Package, And Related Fabrication Methods. Inventors include Patil, Aniket; Buot, Joan Rey Villarba; and Gupta, Piyush. The application for the patent was ...
MUMBAI, India, June 30 -- Intellectual Property India has published a patent application (202647058823 A) filed by Samsung Electronics Co. , Ltd. on May 08, 2026, for Examining Joint Demosaicing And Denoising For Single-Bayer, Quad-Bayer, And Nona-Bayer Patterns. Inventors include Tedla, Saikiran Kumar; Punnappurath, Abhijith; Zhao, Luxi; and Brown, Michael Scott. The application for the patent was published on June 26, 2026, under issue no. 26/2026. Abstract: The present disclosure provides ...