Intellectual Property India Publishes Patent Application for 'Method And Apparatus For Transmitting And Receiving Signal In Wireless Communication System' Filed by Lg Electronics Inc.

MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517070127 A) filed by Lg Electronics Inc., Seoul, Republic of Korea, on July 23, for 'method and apparatus for transmitting and receiving signal in wireless communication system.' Inventor(s) include Myung, Sechang; Kim, Seonwook; Lee, Youngdae; Yang, Suckchel; and Park, Haewook. The application for the patent was published on Aug. 22, under issue no. 34/2025. According to the abstract released by the...


Intellectual Property India Publishes Patent Application for 'Curable Thermally Conductive Adhesive And Thermally Conductive Member' Filed by Sekisui Chemical Co. Ltd.

MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517072381 A) filed by Sekisui Chemical Co. Ltd., Osaka, Japan, on July 30, for 'curable thermally conductive adhesive and thermally conductive member.' Inventor(s) include Furukawa, Atsushi; Iwamoto, Tatsuya; Kobayashi, Yuusuke; and Yoshioka, Tetsurou. The application for the patent was published on Aug. 22, under issue no. 34/2025. According to the abstract released by the Intellectual Property India...


Intellectual Property India Publishes Patent Application for 'Thermally Conductive Resin Composition And Thermally Conductive Member' Filed by Sekisui Chemical Co. Ltd.

MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517072380 A) filed by Sekisui Chemical Co. Ltd., Osaka, Japan, on July 30, for 'thermally conductive resin composition and thermally conductive member.' Inventor(s) include Kobayashi, Yuusuke; Furukawa, Atsushi; Iwamoto, Tatsuya; and Yoshioka, Tetsurou. The application for the patent was published on Aug. 22, under issue no. 34/2025. According to the abstract released by the Intellectual Property Indi...


Intellectual Property India Publishes Patent Application for 'Curable Thermally Conductive Adhesive, Thermally Conductive Member, And Battery Assembly' Filed by Sekisui Chemical Co. Ltd.

MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517072379 A) filed by Sekisui Chemical Co. Ltd., Osaka, Japan, on July 30, for 'curable thermally conductive adhesive, thermally conductive member, and battery assembly.' Inventor(s) include Yoshioka, Tetsurou; Iwamoto, Tatsuya; Kobayashi, Yuusuke; Furukawa, Atsushi; Morimoto, Kohei; and Iino, Tatsuya. The application for the patent was published on Aug. 22, under issue no. 34/2025. According to the a...


Intellectual Property India Publishes Patent Application for 'Method Of Producing A Porous Carbon Material,porous Carbon Material,adsorbent, And Fiber' Filed by Sony Group Corporation

MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517050798 A) filed by Sony Group Corporation, Tokyo, on May 27, for 'method of producing a porous carbon material,porous carbon material,adsorbent, and fiber.' Inventor(s) include Kai Ayumi; Tabata Seiichiro; and Shiroyama Masaya. The application for the patent was published on Aug. 22, under issue no. 34/2025. According to the abstract released by the Intellectual Property India: "The present technol...


Intellectual Property India Publishes Patent Application for 'Communication System' Filed by Mitsubishi Electric Corporation

MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517068263 A) filed by Mitsubishi Electric Corporation, Tokyo, on July 17, for 'communication system.' Inventor(s) include Shimoda, Tadahiro; and Mochizuki, Mitsuru. The application for the patent was published on Aug. 22, under issue no. 34/2025. According to the abstract released by the Intellectual Property India: "Provided is a communication system which enables communication with an ultra-low powe...


Intellectual Property India Publishes Patent Application for 'Methods And Systems For Transmitting Information' Filed by Quarter, Inc.

MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517050790 A) filed by Quarter, Inc., Niwot, U.S.A., on May 27, for 'methods and systems for transmitting information.' Inventor(s) include Diesch, Michael, Wayne; and Diesch, Christopher, Griffin. The application for the patent was published on Aug. 22, under issue no. 34/2025. According to the abstract released by the Intellectual Property India: "Methods and systems for transferring information, com...


Intellectual Property India Publishes Patent Application for 'Measurement Reporting Using A Lookup Table' Filed by Qualcomm Incorporated

MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517068222 A) filed by Qualcomm Incorporated, San Diego, on July 17, for 'measurement reporting using a lookup table.' Inventor(s) include Wang Hua; Luo Tao; Yoo Taesang; and Li Junyi. The application for the patent was published on Aug. 22, under issue no. 34/2025. According to the abstract released by the Intellectual Property India: "Various aspects of the present disclosure generally relate to wire...


Intellectual Property India Publishes Patent Application for 'Schmidt Telescope With Improved Performance, Associated Detecting Devices And Method' Filed by Safran Reosc

MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517048734 A) filed by Safran Reosc, Saint-Pierre-du-Perray, France, on May 20, for 'schmidt telescope with improved performance, associated detecting devices and method.' Inventor(s) include Geyl, Roland. The application for the patent was published on Aug. 22, under issue no. 34/2025. According to the abstract released by the Intellectual Property India: "Disclosed is a compact Schmidt telescope (1) ...


Intellectual Property India Publishes Patent Application for 'Screw Structure' Filed by Hardlock Industry Co. Ltd.

MUMBAI, India, Aug. 22 -- Intellectual Property India has published a patent application (202517068194 A) filed by Hardlock Industry Co. Ltd., Osaka, Japan, on July 17, for 'screw structure.' Inventor(s) include Wakabayashi, Katsuhiko. The application for the patent was published on Aug. 22, under issue no. 34/2025. According to the abstract released by the Intellectual Property India: "The present invention enables generation of a locking effect by means of prevailing torque while reducing t...