MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644040850 A) filed by Google LLC on March 31, 2026, for Non-Scannable Flip-Flop For A Scannable Digital Circuit. Inventors include Arimilli, Rajesh; and Saifee, Shabbir. The application for the patent was published on October 23, 2026, under issue no. 43/2026. Abstract: ABSTRACT Implementations described herein relate to non-scannable flip-flops used within scannable digital circuits. For example, an ...
MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644041208 A) filed by Abb Schweiz AG on March 31, 2026, for Measurement System For Determining A Physical Parameter Of A Pipe-Fluid System. Inventors include Paul Szasz; Vadim Migunov; and Joerg Gebhardt. The application for the patent was published on October 23, 2026, under issue no. 43/2026. Abstract: Title: MEASUREMENT SYSTEM FOR DETERMINING A PHYSICAL PARAMETER OF A PIPE-FLUID SYSTEM The present ...
MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644041704 A) filed by Canon Kabushiki Kaisha - on April 01, 2026, for Substrate Processing Apparatus And Article Manufacturing Method. Inventor includes Koichi Tamura. The application for the patent was published on October 23, 2026, under issue no. 43/2026. Abstract: A substrate processing apparatus comprises a stage (20) configured to hold a substrate (16); a hand (42, 43) configured to convey the s...
MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644044175 A) filed by Pou Chen Corporation on April 07, 2026, for Sprue Bushing And Foaming Mold. Inventors include Liang-Feng Sun; Chih-Hsien Lin; Huei-Ting Zeng; and Hung-Sheng. The application for the patent was published on October 23, 2026, under issue no. 43/2026. Abstract: ABSTRACT SPRUE BUSHING AND FOAMING MOLD A foaming mold (1000) includes at least two sprue bushings (1100) and a mold body (...
MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644044901 A) filed by Pou Chen Corporation on April 08, 2026, for Foam Mold. Inventors include Liang-Feng Sun; Chih-Hsien Lin; Huei-Ting Zeng; and Hung-Sheng. The application for the patent was published on October 23, 2026, under issue no. 43/2026. Abstract: ABSTRACT FOAM MOLD A foam mold (1000) includes a mold main body (1200), and the mold main body (1200) has a height direction and includes a foam...
MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644046312 A) filed by Abb Schweiz AG on April 10, 2026, for Measurement Method For Determining At Least Two Physical Properties Of A Fluid Of A Pipe-Fluid System. Inventors include Vadim Migunov; Joerg Gebhardt; and Paul Szasz. The application for the patent was published on October 23, 2026, under issue no. 43/2026. Abstract: MEASUREMENT METHOD FOR DETERMINING AT LEAST TWO PHYSICAL PROPERTIES OF A FL...
MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644047138 A) filed by Te Connectivity Solutions Gmbh on April 13, 2026, for Quick-Fit Fastener For Two Construction Parts As Well As Assembly With Such A Quick-Fit Fastener. Inventor includes Chritz, Gunther. The application for the patent was published on October 23, 2026, under issue no. 43/2026. Abstract: The present invention relates to a quick-fit fastener (2) for mechanically interconnecting two...
MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644048028 A) filed by Te Connectivity Solutions Gmbh on April 15, 2026, for Tolerance-Compensating Plug-In Housing As Well As Electrical Connector And Housing Assembly With Such A Plug-In Housing. Inventors include Wienziers, Ronald; and Gimbel, Markus. The application for the patent was published on October 23, 2026, under issue no. 43/2026. Abstract: The present invention relates to a plug-in housin...
MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644049262 A) filed by Ryan Mcdaid on April 17, 2026, for Charging Device. Inventor includes Ryan Mcdaid. The application for the patent was published on October 23, 2026, under issue no. 43/2026. Abstract: The present invention discloses a charging device comprising a housing, a biometric sensor disposed at the housing that captures a biometric data of a user, and a light- emitting ring is positioned ...
MUMBAI, India, Oct. 26 -- Intellectual Property India has published a patent application (202644051588 A) filed by Xiamen Hithium Energy Storage Technology Co. , Ltd. on April 22, 2026, for Door Panel Assembly And Energy Storage Container. Inventors include Pengcheng Wang; Xing Su; Hanyu Xie; and Jiepeng Rong. The application for the patent was published on October 23, 2026, under issue no. 43/2026. Abstract: ABSTRACT DOOR PANEL ASSEMBLY AND ENERGY STORAGE CONTAINER The disclosure provides a ...