MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094321 A) filed by Qualcomm Incorporated on August 04, 2026, for Mixed Criticality Non-Secure Protected Scheme. Inventors include Hartley, David; O'Donoghue, Jeremy Robin Christopher; Delfs, Eckhard; and Vial, Aymeric. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: Certain aspects provide a method for processing a transaction. The method generall...
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094322 A) filed by Qualcomm Incorporated on August 04, 2026, for Device Comprising A Heat Dissipation Device With A Flexible Wick. Inventors include Ye, Feihu; Tang, Wei; He, Hui; and Cao, Yan. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: A device comprising a first device frame; a second device frame; a first hinge coupled to the first device ...
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094323 A) filed by Qualcomm Incorporated on August 04, 2026, for Write Data Path For High-Speed Time-Shared Serial Read Write Memories Having Write Mask. Inventors include Raj, Pradeep; Gupta, Richa; Sahu, Rahul; and Gupta, Sharad Kumar. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: A serial read write memory is provided in which a write driver ...
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094324 A) filed by Qualcomm Incorporated on August 04, 2026, for Single Hybrid System-On-Chip (soc) Die Structure With High Memory Bandwidth And Density. Inventors include Kang, Woo Tag; Wang, Zhongze; Badaroglu, Mustafa; and Chidambaram, Periannan. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: A three-dimensional (3D) stacked chip package is de...
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094342 A) filed by Qualcomm Incorporated on August 04, 2026, for Multi-Carrier Aggregation Using Predicted Configurations Corresponding To Neighboring Cells. Inventors include Bansal, Hargovind Prasad; Jayaprakash, Ajay Vignesh; Patil, Kiran; Philip, Phily; Chataraju, Varun; Kumar, Akash; and Nanjunda Swamy, Kiran Kumar. The application for the patent was published on August 07, 2026, under issue no...
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094349 A) filed by Novocycle Holding B. V. on August 04, 2026, for A Battery Cell Dismantling System. Inventor includes Kilic, Ahmet. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: There is provided a battery cell dismantling system comprising: a battery carrier, configured to house a battery; a transportation means configured to carry the batter...
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094355 A) filed by Hitachi Energy Ltd on August 04, 2026, for Method And System For Capacitor Loss Monitoring From Load Signals. Inventors include Bengtsson, Tord; and Ghosh, Riddhi. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: Method performed by a system (10) adapted to measure a condition of one or more capacitors. The system (10) monitors t...
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094357 A) filed by Vlinge Innovation Ab on August 04, 2026, for A Method To Produce A Board Element And A Panel. Inventors include Nygren, Per; and Josefsson, Per. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: The present disclosure relates to a method to produce a board element (1), including extruding a substrate (2) comprising one or more sub...
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094368 A) filed by Qualcomm Incorporated on August 04, 2026, for Low-Dropout Regulator Circuit With Adaptive Transistor Well Switching. Inventor includes Guan, Hua. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: Techniques and apparatus for supplying power in a low-dropout (LDO) regulator circuit are provided. One example LDO regulator circuit ge...
MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647094369 A) filed by Qualcomm Incorporated on August 04, 2026, for Impure Indium Phosphide Semiconductor Substrate On A Silicon Wafer. Inventors include Dutta, Ranadeep; Kim, Jonghae; and Lan, Je-Hsiung. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: Aspects disclosed in the detailed description include an impure Indium Phosphide (InP) semiconducto...