Intellectual Property India Publishes Patent Application for Current-Driven Loopback Calibration

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093741 A) filed by Qualcomm Incorporated on August 03, 2026, for Current-Driven Loopback Calibration. Inventor includes Kim, Sunyoung. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: Certain aspects of the present disclosure generally relate to electronic devices and, more particularly, to techniques and apparatus for calibrating a transceiver. On...


Intellectual Property India Publishes Patent Application for Enhanced Mechanism For Partitioning Address Spaces

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093742 A) filed by Qualcomm Incorporated on August 03, 2026, for Enhanced Mechanism For Partitioning Address Spaces. Inventors include O'Donoghue, Jeremy Robin Christopher; Vial, Aymeric; Delfs, Eckhard; Hartley, David; and Koyuncu, Osman. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: Certain aspects provide a technique for partitioning a memory...


Intellectual Property India Publishes Patent Application for Enhanced User Equipment State Transitions And Dynamic Discontinuous Reception Procedure

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093743 A) filed by Qualcomm Incorporated on August 03, 2026, for Enhanced User Equipment State Transitions And Dynamic Discontinuous Reception Procedure. Inventor includes He, Linhai. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may operate in a first...


Intellectual Property India Publishes Patent Application for Luma Intra Mode Coding

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093744 A) filed by Tencent America LLC on August 03, 2026, for Luma Intra Mode Coding. Inventors include Zhao, Liang H; and Liu, Tianqi. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: The various implementations described herein include methods and systems for coding video. In one aspect, a method includes receiving a video bitstream comprising m...


Intellectual Property India Publishes Patent Application for Method For Manufacturing Substrate With Conductive Through-Via, Metal Paste, And Substrate With Conductive Through-Via

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093751 A) filed by Resonac Corporation on August 03, 2026, for Method For Manufacturing Substrate With Conductive Through-Via, Metal Paste, And Substrate With Conductive Through-Via. Inventors include Ejiri Yoshinori; Sakamoto Masumi; and Shimizu Chiaki. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: Provided is a method for manufacturing a subst...


Intellectual Property India Publishes Patent Application for Antigen-Binding Molecules That Bind Pdgf-B And Pdgf-D, And Methods Of Use

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093786 A) filed by Chugai Seiyaku Kabushiki Kaisha on August 03, 2026, for Antigen-Binding Molecules That Bind Pdgf-B And Pdgf-D, And Methods Of Use. Inventors include Chen, Dan; Yang, Bo; Kanamori, Masakazu; Takahashi, Noriyuki; and Ikawa, Yuri. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: The present invention provides multispecific antigen-b...


Intellectual Property India Publishes Patent Application for Integrated Circuit (ic) Package Including Two Substrates And Vertical Interconnects Coupling The Two Substrates, The Vertical Interconnects Comprising A Metal Ball And Metal Pin Combination To Address An Increased Distance Between Substrates

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093831 A) filed by Qualcomm Incorporated on August 03, 2026, for Integrated Circuit (ic) Package Including Two Substrates And Vertical Interconnects Coupling The Two Substrates, The Vertical Interconnects Comprising A Metal Ball And Metal Pin Combination To Address An Increased Distance Between Substrates. Inventors include Wang, Zhijie; Buot, Joan Rey Villarba; and Patil, Aniket. The application fo...


Intellectual Property India Publishes Patent Application for Group-Common Control Information For Indicating User Equipment-Specific Physical Downlink Control Channel Candidates

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093833 A) filed by Qualcomm Incorporated on August 03, 2026, for Group-Common Control Information For Indicating User Equipment-Specific Physical Downlink Control Channel Candidates. Inventors include Khoshnevisan, Mostafa; Sarkis, Gabi; Liu, Le; and Xu, Huilin. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: Various aspects of the present disclos...


Intellectual Property India Publishes Patent Application for Communication Method And Related Apparatus

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093865 A) filed by Huawei Technologies Co. , Ltd. on August 03, 2026, for Communication Method And Related Apparatus. Inventors include Liang, Yujun; Fang, Xuming; He, Rong; and Du, Rui. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: The present application is applied in the technical field of communications. Provided are a communication method a...


Intellectual Property India Publishes Patent Application for Xenogeneic Oral Repair Compositions And Implants Thereof

MUMBAI, India, Aug. 12 -- Intellectual Property India has published a patent application (202647093960 A) filed by Viscus Biologics, LLC on August 03, 2026, for Xenogeneic Oral Repair Compositions And Implants Thereof. Inventors include Gingras, Peter H.; Fraifogl, Nicole; and Monsonis, Hector Capella. The application for the patent was published on August 07, 2026, under issue no. 32/2026. Abstract: The present disclosure relates generally to oral tissue repair compositions and implants ther...