MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088702 A) filed by Qualcomm Incorporated on July 21, 2026, for Integrated Device Comprising Extended Metallization Region For Pillar Interconnects. Inventors include Patil, Aniket; He, Dongming; and Lisk, Durodami. The application for the patent was published on July 24, 2026, under issue no. 30/2026. Abstract: An integrated device comprising a die substrate; a die interconnection portion coupled t...
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088703 A) filed by Qualcomm Incorporated on July 21, 2026, for Video Headsets With Fluid-Based Cooling Systems And Related Methods. Inventors include Wang, Peng; Yu, Youmin; and Nikfar, Nader. The application for the patent was published on July 24, 2026, under issue no. 30/2026. Abstract: In a video headset, a video display inside an extended reality (XR) device is controlled by electronic circuit...
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088704 A) filed by Qualcomm Incorporated on July 21, 2026, for Package Substrate. Inventors include Kang, Kuiwon; Bchir, Omar James; We, Hong Bok; and Choi, Seongryul. The application for the patent was published on July 24, 2026, under issue no. 30/2026. Abstract: Disclosed are techniques for a structure of a package substrate. In an aspect, a package substrate includes a core dielectric that incl...
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088713 A) filed by Qualcomm Incorporated on July 21, 2026, for A Reconfigurable Dual Input Receiver Front End. Inventors include Xiong, Zhijie; and So, Alexander. The application for the patent was published on July 24, 2026, under issue no. 30/2026. Abstract: A low-noise amplifier (LNA) includes a first transistor (610), a second transistor (615), and a load (670). The LNA also includes a first re...
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088714 A) filed by Rf Singapore Pte. Ltd. on July 21, 2026, for High Q Electroacoustic Resonator. Inventors include Chauhan, Vikrant; Mayer, Markus; Forster, Thomas; Geselbracht, Philipp; Sabbagh, Manuel; and Ammann, Stefan. The application for the patent was published on July 24, 2026, under issue no. 30/2026. Abstract: Aspects include high q resonator devices and associated systems and methods. I...
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088715 A) filed by Thk Co. , Ltd. on July 21, 2026, for Rolling Guiding Device. Inventors include Hayashi Yuki; Ozeki Ryunosuke; and Tang Jie. The application for the patent was published on July 24, 2026, under issue no. 30/2026. Abstract: The present invention is characterized by comprising a raceway member (200) and a moving member (300) that is mounted on the raceway member (200) with multiple ...
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088721 A) filed by Qualcomm Incorporated on July 21, 2026, for Extrapolation And Interactions Of Digital Twin-Based Models And Applications. Inventors include Kesavareddigari, Himaja; Li, Qing; Cheng, Hong; Gulati, Kapil; and Kumari, Preeti. The application for the patent was published on July 24, 2026, under issue no. 30/2026. Abstract: Systems and techniques for wireless communications are descri...
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088725 A) filed by Windmller & Hlscher Se & Co. Kg on July 21, 2026, for Winder, System, And Method. Inventors include Niemller, Robert; Ehrenberg, Rainer; Schtte, Adrian; Lindenschmidt, Patrick; and Erdmann, Daniel. The application for the patent was published on July 24, 2026, under issue no. 30/2026. Abstract: A winder (1), having a roll receptacle (2, 3) for holding and mounting a material roll...
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088730 A) filed by Ge Vernova Infrastructure Technology LLC on July 21, 2026, for A Method For Repairing A Joint Connection Of A Wind Turbine Blade Root. Inventors include Thuesen, Jesper; and Bentsen, Peter. The application for the patent was published on July 24, 2026, under issue no. 30/2026. Abstract: There is described a method of repairing a joint connection of a wind turbine blade root. The ...
MUMBAI, India, July 31 -- Intellectual Property India has published a patent application (202647088731 A) filed by Mitsui Kinzoku Company, Limited on July 21, 2026, for Exhaust Gas Purification Catalyst. Inventors include Asakoshi Toshiki; Nakamura Kouta; Watanabe Tokuya; and Iwakura Hironori. The application for the patent was published on July 24, 2026, under issue no. 30/2026. Abstract: The purpose of the present invention is to provide an exhaust gas purification catalyst capable of impro...